3D Printed Backshell for Printed Circuit Boards

case-studies Description

Accelerating connectors development

The Challenge

  • Speed mold with LCP materials on CNC. Expensive and time consuming for functional prototyping.
  • Current 3D resins get delayered and couldn’t withstand the high temperatures (>200°C) associated with surface mount technology-based automated wave soldering systems.

The Solution

The high accuracy printing on the Asiga devices with LOCTITE 3D 3955 HDT280 FST enables better design of fine detailed parts. Printing the connectors with the 3D material also allow the prototyping of the PCB assembly along with the electronic components. Loctite 3955 printed connectors can withstand the high temperatures associated with surface mount technology-based wave soldering systems.

Benefits

  • Better and faster design optimization of parts
  • Faster time to market
  • Customers can now rapidly test assembled PCB systems to get optimum designs and customer approvals faster compared to the traditional way of developing injection mold metal tools.

Developed together with